JPH0516215Y2 - - Google Patents
Info
- Publication number
- JPH0516215Y2 JPH0516215Y2 JP7423887U JP7423887U JPH0516215Y2 JP H0516215 Y2 JPH0516215 Y2 JP H0516215Y2 JP 7423887 U JP7423887 U JP 7423887U JP 7423887 U JP7423887 U JP 7423887U JP H0516215 Y2 JPH0516215 Y2 JP H0516215Y2
- Authority
- JP
- Japan
- Prior art keywords
- target
- plate
- bonding
- magnet
- sputtering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007767 bonding agent Substances 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423887U JPH0516215Y2 (en]) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423887U JPH0516215Y2 (en]) | 1987-05-18 | 1987-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63183261U JPS63183261U (en]) | 1988-11-25 |
| JPH0516215Y2 true JPH0516215Y2 (en]) | 1993-04-28 |
Family
ID=30919268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7423887U Expired - Lifetime JPH0516215Y2 (en]) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0516215Y2 (en]) |
-
1987
- 1987-05-18 JP JP7423887U patent/JPH0516215Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63183261U (en]) | 1988-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5490913A (en) | Magnetic field enhanced sputtering arrangement with vacuum treatment apparatus | |
| JPH02290973A (ja) | 薄膜形成装置 | |
| JP2004285471A (ja) | アーク噴霧コーティングアプリケーション及び機能を容易にするハードウェア・フィーチャーの設計 | |
| JPH0516215Y2 (en]) | ||
| CN101126152A (zh) | 柱状磁控溅射器 | |
| JPH02243761A (ja) | マグネトロンスパッタリング源用電磁石の制御方法 | |
| JP6588351B2 (ja) | 成膜方法 | |
| CN218710809U (zh) | 旋转靶磁控溅射阴极磁场装置 | |
| JPH11350123A (ja) | 薄膜製造装置および液晶表示基板の製造方法 | |
| JP2004084007A (ja) | スパッタ装置 | |
| CN114369803A (zh) | 一种新型的共溅双平面磁控靶 | |
| JP2625789B2 (ja) | マグネトロンスパッタカソード | |
| CN115522172B (zh) | 一种旋转靶磁控溅射阴极磁场装置 | |
| CN118880263B (zh) | 一种pvd通用型平面靶座装置 | |
| JPH05339726A (ja) | マグネトロンスパッタ装置 | |
| JPH03215663A (ja) | スパッタリング装置 | |
| JPS6016515B2 (ja) | 低温スパツタリング装置 | |
| JPS60204878A (ja) | スパツタリングタ−ゲツト | |
| JP2002121663A (ja) | スパッタ装置用トレイ | |
| JPS621867A (ja) | スパツタ装置 | |
| CN103314129A (zh) | 阴极 | |
| JPH08236062A (ja) | スパツタ装置 | |
| JPH05263224A (ja) | スパッタ電極 | |
| JPS6152360A (ja) | スパツタ成膜装置 | |
| JPH08239751A (ja) | スパツタ装置 |